Rev. 6 — 3 December Product data sheet. Table 1. Ordering information. Type number Package. Temperature range Name. Description. Version. when gated with the Clock of the HC .. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in. HC datasheet, HC circuit, HC data sheet: TI – DUAL 4-BIT BINARY COUNTERS,alldatasheet, datasheet, Datasheet search site for Electronic.
|Published (Last):||19 October 2010|
|PDF File Size:||5.76 Mb|
|ePub File Size:||9.8 Mb|
|Price:||Free* [*Free Regsitration Required]|
Published on Apr View Download 8.
N-bit binary counters can be implementedwith each package, providing the capability ofdivide by The HC devices have paralleloutputs from each counter stage so that anysubmultiple of the input count frequency isavailable for system timing signals.
Package thermal vatasheet, JA see Note 2: Storage temperature range, Tstg 65C to C. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, andfunctional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is notimplied. Exposure to absolute-maximum-rated conditions for extended periods may affect device ddatasheet.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
HC Datasheet(PDF) – TI store
The package thermal impedance is calculated in accordance with JESD CL includes probe and test-fixture capacitance. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the followingcharacteristics: The outputs are measured one at a time with one input transition per measurement. Product device recommended for new designs.
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Hc393 datasheet pdf
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Device has been announced but is not in production. Samples may or may not be available. TI has discontinued the production of the device. TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.
Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used betweenthe die and leadframe.
If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device. Finish options are separated by a vertical ruled line. Important Information and Disclaimer: The information provided on this page represents TI’s knowledge and belief as of the date that it is provided.
TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information.
Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI’s liability arising out of such information exceed the total purchase price of the TI part s at issue in this document sold by TI to Customer on an annual basis.
All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. This drawing is subject to change without notice. This package is hermitically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
All linear dimensions are in millimeters. Body dimensions do not include mold flash or protrusion not to exceed 0, Buyersshould obtain the latest relevant information before placing orders and should verify that such information is current and complete. TIs published terms of sale for semiconductor products http: Additional terms may apply to the use or sale of other types of TI products andservices. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices.
TI is not responsible or liable for such reproduceddocumentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statementsdifferent from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for theassociated TI product or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products collectively, Designers understand and agree that Designersremain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers havefull and exclusive responsibility to assure the safety of Designers’ applications and compliance of their applications and of all TI productsused in or for Designers applications with all applicable regulations, laws and other applicable requirements.
Designer datasheeet that, withrespect to their applications, Datazheet has all the necessary expertise to create and implement safeguards that 1 anticipate dangerousconsequences of failures, 2 monitor failures and their consequences, and 3 lessen the likelihood of failures that might cause harm andtake appropriate actions. Designer agrees that prior to using or distributing datasueet applications that include TI products, Designer willthoroughly test such applications and the functionality of such TI products as used in such applications.
TIs provision of technical, application or other design advice, quality characterization, reliability data or other services or information,including, but not limited to, reference designs and materials relating to evaluation modules, collectively, TI Resources are intended toassist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in anyway, Designer individually or, if Designer is acting on behalf of a company, Designers company agrees to use any particular TI Resourcesolely for this purpose and subject to the terms of this Notice.
TI reserves the right to make corrections,enhancements, improvements and other changes to its TI Resources.
TI has not conducted any testing other than that specificallydescribed in the published documentation for a particular Xatasheet Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications thatinclude the TI product s identified in such TI Resource. Informationregarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty orendorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard e.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, suchproducts are intended to help enable customers to design and create their own applications that meet applicable functional safety standardsand requirements. Using products in an application does not by itself establish any safety features in the application. Designers mustensure compliance with safety-related requirements and standards applicable to their applications.
Designer may not use any TI products inlife-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death e. Such equipment includes, without limitation, allmedical devices identified by the U. TI may expressly designate certain products as completing a particular qualification e.
Designers agree that it has the necessary expertise to select the product with the appropriate qualification datasheeh for their applicationsand that proper product selection is at Designers own risk.
Designers are solely responsible for compliance with all legal and regulatoryrequirements in connection with such selection. V mware v sphere – optimize and scale v 5 5 2 Technology.